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By Banqiu Wu,Ajay Kumar,Sesh Ramaswami
The most modern advances in 3-dimensional built-in circuit stacking technology
With a spotlight on business functions, 3D IC Stacking Technology bargains finished assurance of layout, try out, and fabrication processing tools for three-d gadget integration. each one bankruptcy during this authoritative advisor is written by way of specialists and info a separate fabrication step. destiny purposes and state-of-the-art layout strength also are mentioned. this is often a necessary source for semiconductor engineers and transportable machine designers.
3D IC Stacking Technology covers:
- High density via silicon stacking (TSS) technology
- Practical layout atmosphere for heterogeneous 3D IC products
- Design automation and TCAD software recommendations for via silicon through (TSV)-based 3D IC stack
- Process integration for TSV manufacturing
- High-aspect-ratio silicon etch for TSV
- Dielectric deposition for TSV
- Barrier and seed deposition
- Copper electrodeposition for TSV
- Chemical mechanical sharpening for TSV applications
- Temporary and everlasting bonding
- Assembly and try out features of TSV technology
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3D IC Stacking Technology by Banqiu Wu,Ajay Kumar,Sesh Ramaswami